Advances in Interconnect Technologies: An International Journal(AITIJ)

                                                       http://airccse.com/aitij/index.html

                                               **********************************************************
Call for papers
***************

Advances in Interconnect Technologies: An International Journal (AITIJ) invites original and significant contributions relating to the theory, design, performance and reliability of interconnect, including materials, analysis, modeling and simulation of interconnect. The journal proposes to stimulate the development of latest technology in industry and academia. High quality review papers and short communications are also acceptable.

Research areas suitable for publication include, but are not limited to the following fields:


	Emerging Materials
	CNT/ Graphene Interconnects
	Modeling and Simulation
	Testing
	RFIC
	Optical Interconnects
	Wireless Interconnects
	Microstrip Lines
	Analog and Mixed Signals
	Dedicated Software and Systems for Developing Interconnect Technology
	On-Chip and Off-Chip Interconnects
	EMC/EMI
	FPGA/ASICs
	Fabrication Techniques
	Neural Networks
	Parasitics Issues
	Optimization Techniques



Paper Submission
****************

	Authors are invited to submit papers for this journal through E-mail: aitijjournal@airccse.com. Submissions must be original and should not have been published previously or be under consideration for publication while being evaluated for this Journal. 

Important Dates
****************

Submission Deadline  : June 17, 2026
Notification         : July 17, 2026
Final Manuscript Due : July 24, 2026
Publication Date        : Determined by the Editor-in-Chief
        
For other details please visit http://airccse.com/aitij/index.html